Advanced Ceramics for
High-Tech Industries
Products : 3D interconnection devices
Microcertec can offer interconnection circuits on flat or 3D ceramic components to be used for electronics component integration. These microelectronics circuits are made with both thin-film metallisation and high-precision laser ablation techniques on ceramic carriers. These are machined to tight tolerances, show good electrical insulation and thermal dissipation and superior dimension stability.
Applications
Ceramic 3D interconnection devices are specifically used in the :
- microelectronics industry
- optoelectronics industry
- aerospace industry
Products
Microcertec offer the following customised 3D interconnection devices :
- carriers for microelectronics circuits and chips
- sensor carriers
- LED carriers
Electronic circuits on ceramic devices are made of vacuum thin-film metallised layers with thicknesses of about 1 to 2 µm.
Another process based upon laser surface activation and electro or chemical coating makes it possible to offer metallised layers with thicknesses in the range of 1 to 20 µm.
Materials
For these applications, we mainly use the following advanced ceramics :
- Alumina (94 to 99.8 %)
- AlN - sintered aluminium nitride
- Quartz
Thin-film metallising
Microcertec can offer the following thin-film metallised layers made under vacuum for your components to be bonded or brazed :
- titanium - platinum – gold
- chromium - nickel - gold
- copper, aluminium, silver, or indium
- resistive layers - Ta2N
These thin-film metallised layers can be uniquely made on 3D components. They are ablated afterwards by laser micro-machining in order to create electrical paths or insulating areas.
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3D interconnection devices (89.38 Ko)
