Advanced Ceramics for
High-Tech Industries
Products : Substrates, insulators, dielectrics for the Microelectronics
Ceramic components offer significant advantages over metal and plastic parts. They retain their full dimensional stability at high temperatures – well above 1000°c. They show a high-wear resistance to corrosive environment. They are extremely good electrical insulators. They do not outgas in vacuum.
Applications
Insulators, heat sinks and circuit carriers made from advanced ceramics are used to insulate and/or dissipate the heat generated by components as well as ensure good dimensional stability in the following applications :
- electronics interconnection devices : 3D packaging - mecatronics - 3DMID
- high-frequency components, circulators
- high-frequency assemblies for antennas
- sensors
- ceramic packages
Products
Mirocertec offers the following customised components :
- insulators
- heat sinks
- 3D-interconnection devices
- substrates
- loads, absorbers, dielectrics, ferrites
Materials
For these applications, we mainly use the following advanced ceramics :
- sintered aluminium nitride – AlN – due to its higher thermal dissipation but still offering perfect electrical insulation
- alumina for applications where electrical insulation is solely required
- Macor ® for a good thermal as well as electrical insulation
- ferrites, dielectrics and absorbing materials for their dielectric and microwave properties.
Thin-film metallising
Thin-film metallised layers made under vacuum can be deposited on these ceramic heat sinks and electrical insulators in addition to our precision grinding. Microcertec can offer the following thin-film metallised layers for your components to be bonded or brazed :
- titanium - platinum – gold
- chromium - nickel - gold
- copper, aluminium, silver, or indium
- resistive layers - Ta2N
These thin-film metallised layers can be uniquely made on 3D components. They can be ablated afterwards by laser micro-machining in order to create electrical paths or insulating areas
Download
Components for the Microelectronics (86.8 Ko)
