Advanced Ceramics for
High-Tech Industries
News
SMT/HYBRID/PACKAGING
3 - 5 June 2008 in Nürnberg
The three-day microelectronics exhibition gave Microcertec the opportunity to introduce the visitors with its three-dimensional interconnection ceramic devices aimed to be used for the packaging of sensors, chips and LED's.
We are glad that our techniques of diamond grinding, thin-film metallising and laser patterning were of interest to a large number of visitors .
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